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ODM 1-108 Layer Rigid Flex PCB Prototype Board Manufacturing For Electronic Products

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ODM 1-108 Layer Rigid Flex PCB Prototype Board Manufacturing For Electronic Products

Place of Origin : China

MOQ : 1

Price : Contact Us

Payment Terms : T/T

Supply Ability : 200,000+ m² PCB per Month

Layer : 1-108 layers

Material : Fr4

Thickness : 0.5-10mm

Min. Line Width/Space : 0.1/0.1mm

Surface Treatment : Immersion Gold/ENIG/HASL

Type : Customizable

Application : Electronic Products

Standard : UL&IPC Standard &ISO

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1-108 Layer Prototype PCB Manufacturing Serivice for Electronic Products

♦ What is Prototype PCB Manufacturing?

Prototype PCB Manufacturing is the process of creating small batches of printed circuit boards (PCBs) for testing and validation before mass production. It allows engineers and designers to verify the functionality, design, and performance of a PCB before committing to large-scale manufacturing.

♦ What is Steps in Prototype PCB Manufacturing?

1. Design & Layout
  - PCB schematics are designed using CAD software (e.g., Altium, KiCad, Eagle).
  - Design files (Gerber, drill files, BOM) are generated.
2. Material Selection
  - Choose substrate material (FR-4, Rogers, flexible PCB materials).
  - Select copper thickness, solder mask, and surface finish (HASL, ENIG, OSP).
3. Fabrication Process
  - Printing: Transferring the design onto the PCB laminate.
  - Etching: Removing excess copper to form traces.
  - Drilling: Creating holes for vias and component leads.
  - Plating: Depositing conductive material in drilled holes.
  - Solder Mask & Silkscreen: Adding protective coating and labels.
4. Testing & Inspection
  - Electrical testing (continuity, isolation checks).
  - Visual inspection for defects (misalignment, shorts).
5. Assembly (Optional)
  - Components are soldered onto the PCB (SMT or through-hole).
  - Functional testing to ensure performance.

ODM 1-108 Layer Rigid Flex PCB Prototype Board Manufacturing For Electronic Products

♦ Technical Parameters

Item	Spec
Layers	1~64
Board Thickness	0.1mm-10 mm
Material	FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc
Max Panel Size	800mm×1200mm
Min Hole Size	0.075mm
Min Line Width/Space	Standard: 3mil(0.075mm) Advance: 2mil
Board Outline Tolerance	士0.10mm
Insulation Layer Thickness	0.075mm--5.00mm
Out Layer Copper Thickness	18um--350um
Drilling Hole (Mechanical)	17um--175um
Finish Hole (Mechanical)	17um--175um
Diameter Tolerance (Mechanical)	0.05mm
Registration (Mechanical)	0.075mm
Aspect Ratio	17:01
Solder Mask Type	LPI
SMT Min. Solder Mask Width	0.075mm
Min. Solder Mask Clearance	0.05mm
Plug Hole Diameter	0.25mm--0.60mm

Product Tags:

ODM pcb prototype board

Electronic pcb prototype board

ODM rigid flex pcb prototype

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