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Aluminum Surface Mount Circuit Board Electronic PCB Board Thermal Conductivity RF Processing

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Aluminum Surface Mount Circuit Board Electronic PCB Board Thermal Conductivity RF Processing

MOQ : 1

Price : Contact us

Payment Terms : T/T

Layer : 8L

Material : Aluminum

Copper Thickness : 1-3OZ

Min. Component Size : 01005

Min. Line Width/Spacing : 4/4 mil

Assembly Method : SMT/DIP

Item : ODM/OEM

Application : Base Atation RF Processing

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Aluminum PCB Thermal Conductivity RF Processing PCBA Telecom PCB Assembly

♦ What's Telecom PCB Assembly?

Telecom PCB Assembly refers to the manufacturing and assembly of printed circuit boards (PCBs) specifically designed for telecommunications equipment, such as:

5G/4G base stations
Fiber-optic networking devices
Satellite communication systems
Routers, switches, and modems
RF (Radio Frequency) and microwave systems

These PCBs require high-frequency performance, signal integrity, and reliability to handle fast data transmission, low latency, and harsh operational environments.

♦ Features of Telecom PCBs:

1. High-Frequency Materials

- Use low-loss laminates (e.g., Rogers, Teflon, or Isola) to minimize signal degradation at GHz frequencies.
- Controlled impedance traces to prevent signal reflection.

2. Multilayer & HDI (High-Density Interconnect) Designs

- 8+ layers for complex routing.
- Microvias & blind/buried vias for compact, high-speed designs.

3. RF & Microwave Components

- Antennas, amplifiers, filters, and MMICs (Monolithic Microwave ICs).
- Shielding to reduce electromagnetic interference (EMI).

4. Thermal Management

- Metal-core PCBs (e.g., aluminum), heat sinks, or thermal vias to dissipate heat from high-power components.

5. Strict Compliance Standards

- - IPC-A-600, IPC-6012 (for reliability).
  - RoHS, REACH (for environmental safety).
  - FCC, CE, ITU-T (for telecom regulations).

♦ Telecom PCB Assembly Process Characteristics

- Components: high-frequency substrate (PTFE), high-temperature resistant chip (-40℃~125℃), 50Ω impedance matching.
- Manufacturing accuracy: patch ±0.025mm (normal ±0.05mm), laser drilling + HDI high-density wiring.
- Special processes: impedance control (differential line ±10%), electromagnetic shielding (metal cover), thermal management (aluminum substrate heat dissipation).

♦ Technical Parameters

PCB Assembly Capability
Item				Normal	Special
SMT Assembly	PCB(used for SMT) specification	Length and Width( L* W)	Minimum	L≥3mm, W≥3mm	L＜2mm
		Length and Width( L* W)	Maximum	L≤800mm, W≤460mm	L ＞ 1200mm, W＞500mm
		Thickness( T)	Thinnest	0.2mm	T＜0.1mm
		Thickness( T)	Thickest	4 mm	T＞4.5mm
	SMT components specification	Outline Dimension	Min size	0201(0.6mm*0.3mm)	01005(0.3mm*0.2mm)
			Max size	200 * 125	200 * 125
			component thickness	T≤15mm	6.5mm＜T≤15mm
		QFP,SOP,SOJ (multi pins)	Min pin space	0.4mm	0.3mm≤Pitch＜0.4mm
		CSP/ BGA	Min ball space	0.5mm	0.3mm≤Pitch＜0.5mm
DIP Assembly	PCB specification	Length and Width( L* W)	Minimum	L≥50mm, W≥30mm	L＜50mm
		Length and Width( L* W)	Maximum	L≤1200mm, W≤450mm	L≥1200mm, W≥500mm
		Thickness( T)	Thinnest	0.8mm	T＜0.8mm
		Thickness( T)	Thickest	3.5mm	T＞2mm

♦ One-Stop PCBA Solution


PCBA Prototype	Industrial Control PCBA	Telecom PCBA	Medical PCBA

Automotive PCBA	Consumer Electronic PCBA	LED PCBA	Security PCBA

♦ Advantages of DQS Team

On-time Delivery:

- Owned PCBA factories 15,000 ㎡
- 13 fully automatic SMT lines
- 4 DIP assembly lines

2. Quality Guaranteed:

- IATF, ISO, IPC, UL standards
- Online SPI, AOI, X-Ray Inspection
- The qualified rate of products reach 99.9%

3. Premium Service:

- 24H reply your inquiry
- Perfect after-sales service system
- From prototype to mass production

Product Tags:

Aluminum surface mount circuit board

RF surface mount circuit board

RF electronic pcb board

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