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High Frequency Prototype RF Printed Circuit Board Rogers RT5880 PCB

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High Frequency Prototype RF Printed Circuit Board Rogers RT5880 PCB

MOQ : 1

Price : Send us Gerber file for free quotation

Payment Terms : T/T

Layer : 12 Layer

Material : Rogers RT5880

Thickness : 1.8 mm

Min. Line Width/Space : 0.1/0.1mm

Copper Thickness : 1OZ

Surface Finishing : ENIG

Color : Blue

Application : Communication System

Certificate : UL & IPC Standard & ISO

Service : One Stop Turnkey Service

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Rogers RT5880 High Frequency PCB Satellite Communication System Application

What's High-Frequency PCB?

High-frequency PCB is a special circuit board designed for high-frequency electromagnetic scenes, suitable for high-frequency (frequency>300MHz, corresponding to wavelength <1 meter) and microwave (frequency>3GHz, corresponding to wavelength <0.1 meter) fields. It is based on microwave substrate copper clad laminate, combined with some processes of ordinary rigid circuit board manufacturing, or made through special processing.

High Frequency Prototype RF Printed Circuit Board Rogers RT5880 PCB High Frequency Prototype RF Printed Circuit Board Rogers RT5880 PCB High Frequency Prototype RF Printed Circuit Board Rogers RT5880 PCB

♦ Features of High-Frequency PCB

    • Special materials: use low Dk/Df substrates such as PTFE, ceramic filling materials, LCP, etc. to reduce signal attenuation (PTFE is the first choice for 5G).

    • Precise transmission: impedance control of ±5%, micron-level line accuracy, 30%+ loss reduction in millimeter wave band, and excellent phase stability.

    • Complex process: laser drilling accuracy of ±3μm, plasma etching instead of pickling, multi-layer board integrated passive devices, and high-yield production in dust-free workshops.

    • Strong heat dissipation: metal substrate + thermal simulation + phase change material, adapting to extreme environments from -55℃ to 125℃.

Difficulties in High-frequency PCB Manufacturing Process

    • Material processing is difficult: PTFE drilling is prone to burrs, and tungsten carbide drill bits + plasma cleaning are required.

    • High micropore precision: small holes are prone to offset, laser drilling + electroplating filling holes.

    • Difficult graphic transfer: small line width is prone to deviation, LDI lithography + fine etching.

    • Difficult inter-layer alignment: lamination is prone to misalignment, CCD alignment control offset ≤±50μm.

    • Difficult surface treatment: uneven coating affects performance, and the coating thickness is strictly controlled.

Technical Parameters

Item

Specification

Laers

1~32

Board thickness

0.1mm-7.0mm

Material

FR-4,CEM-1/CEM-3,PI,High Tg,Rogers

Max panel size

32"×48"(800mm×1200mm)

Min hole size

0.075mm

Min line width

3mil(0.075mm)

Surface finish

OSP,HASL,Imm Gold/Nickel/Ag, Electric gold

Copper thickness

0.5-7.0OZ

Soldermask

Green/Yellow/Black/White/Red/Blue

Silkscreen

Red/Yellow/Black/White

Min PAD

5mil(0.13mm)

Inter package

Vacuum

Outer package

Carton

Outline tolerance

±0.75mm

Hole tolerance

PTH:±0.05 NPTH:±0.025

Certificate

UL,ISO 9001,ISO14001,IATF16949

Special request

Blind hole+Gold finger + BGA

Material Suppilers

Shengyi, KB, Nanya, ITEQ,etc.

One-Stop PCBs Solution

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Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production


Product Tags:

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