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Immersion Gold ENIG Rohs HDI Multilayer PCB 16 Layer For Electronic Product

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Immersion Gold ENIG Rohs HDI Multilayer PCB 16 Layer For Electronic Product

MOQ : 1

Price : Contact Us

Payment Terms : T/T

Supply Ability : 200,000+ m² PCB per Month

Layer : 16 layers

Material : Fr4

Thickness : 3.0 mm

Construction : 4+N+4

Min. Line Width/Space : 0.1/0.1mm

Surface Treatment : Immersion Gold

Type : Customizable

Application : Electronic Product

Standard : UL&IPC Standard &ISO

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16 Layer Immersion Gold HDI PCB for Electronic Product

♦ What is Immersion Gold?

Immersion Gold (also known as ENIG – Electroless Nickel Immersion Gold) is a surface finish applied to printed circuit boards (PCBs) to protect exposed copper pads and ensure reliable solder connections. It consists of two layers:

1. Electroless Nickel (Ni) – A thin (3–6µm) nickel-phosphorus layer deposited chemically (without electricity) to act as a barrier, preventing copper diffusion.
2. Immersion Gold (Au) – A very thin (0.05–0.1µm) gold layer plated over the nickel to prevent oxidation and enhance solderability.

Immersion Gold ENIG Rohs HDI Multilayer PCB 16 Layer For Electronic Product

♦ Key Characteristics of Immersion Gold (ENIG):

✔ Flat Surface – Ideal for fine-pitch components (e.g., BGAs, QFNs).
✔ Excellent Solderability – Ensures strong, reliable solder joints.
✔ Long Shelf Life – Resists oxidation better than bare copper or OSP.
✔ Wire-Bondable – Suitable for gold or aluminum wire bonding (used in IC packaging).
✔ Lead-Free & RoHS Compliant – Environmentally friendly compared to HASL (lead-based).

♦ Comparison with Other PCB Finishes?

Finish	Thickness	Flatness	Solderability	Cost	Best For
ENIG (Immersion Gold)	Thin Au (0.05–0.1µm)	Very Flat	Excellent	Moderate	High-reliability, fine-pitch
HASL (Hot Air Solder Leveling)	Thick Sn/Pb or Sn	Uneven	Good	Low	General-purpose PCBs
OSP (Organic Solderability Preservative)	Organic coating	Flat	Good (but degrades over time)	Low	Short-life consumer electronics
Electrolytic Hard Gold	Thick Au (0.5–1.5µm)	Flat	Good (but requires nickel underlayer)	High	Connectors, wear-resistant parts

♦ Technical Parameters

Item	Spec
Layers	1~64
Board Thickness	0.1mm-10 mm
Material	FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc
Max Panel Size	800mm×1200mm
Min Hole Size	0.075mm
Min Line Width/Space	Standard: 3mil(0.075mm) Advance: 2mil
Board Outline Tolerance	士0.10mm
Insulation Layer Thickness	0.075mm--5.00mm
Out Layer Copper Thickness	18um--350um
Drilling Hole (Mechanical)	17um--175um
Finish Hole (Mechanical)	17um--175um
Diameter Tolerance (Mechanical)	0.05mm
Registration (Mechanical)	0.075mm
Aspect Ratio	17:01
Solder Mask Type	LPI
SMT Min. Solder Mask Width	0.075mm
Min. Solder Mask Clearance	0.05mm
Plug Hole Diameter	0.25mm--0.60mm

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Immersion Gold ENIG Rohs HDI Multilayer PCB 16 Layer For Electronic Product

Immersion Gold ENIG Rohs HDI Multilayer PCB 16 Layer For Electronic Product

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