Immersion Gold SMD Multilayer Circuit Board PCB 12 Layer For Communication Equipment

12 Layer High Frequency High Speed PCB for Communication Equipment

♦ What's High Speed PCB?

A ​​High-Speed PCB​​ is a printed circuit board designed to handle ​​fast digital signals with minimal distortion, crosstalk, or timing errors​​. These PCBs are optimized for signal integrity (SI) and power integrity (PI) in applications where signal frequencies exceed ​​50 MHz–100+ GHz​​, such as in ​​5G networks, high-performance computing, and advanced data communication systems​​.

♦ ​​​​Key Characteristics of High-Speed PCBs​​​

✅ ​​Controlled Impedance​​ – Ensures signal reflections are minimized (e.g., 50Ω or 100Ω differential pairs).
✅ ​​Low Signal Loss​​ – Uses ​​low-loss dielectric materials​​ (e.g., Rogers, Isola) to reduce attenuation.
✅ ​​Minimal Crosstalk​​ – Careful trace spacing and shielding prevent interference.
✅ ​​Strict Timing Requirements​​ – Matched trace lengths for differential pairs (e.g., PCIe, DDR5).
✅ ​​Optimized Power Delivery​​ – Low-impedance power planes to prevent voltage drops.

♦ ​​Critical Design Considerations​​​​

1. Material Selection​​

• • ​​Standard FR-4​​ (for < 1 GHz signals).
  • ​​High-Speed Laminates​​ (e.g., ​​Rogers RO4000, Isola I-Tera, Panasonic Megtron 6​​) for > 5 Gbps signals.

​​2. Layer Stackup​​

• • ​​Signal Layers​​ – Adjacent to ground planes for impedance control.
  • ​​Power Planes​​ – Low-inductance design with decoupling capacitors.
  • ​​Symmetrical Stackup​​ – Prevents warping and ensures consistent performance.

​​3. Trace Routing​​

• • ​​Differential Pairs​​ – Tightly coupled with matched lengths (e.g., USB 3.2, HDMI).
  • ​​Avoid 90° Bends​​ – Use ​​45° or curved traces​​ to reduce reflections.
  • ​​Via Optimization​​ – Minimize stubs (use ​​blind/buried vias​​ for HDI designs).

​​4. Power Integrity (PI)​​

• • ​​Low-ESR Decoupling Caps​​ – Placed near ICs to suppress noise.
  • ​​Power Plane Splitting​​ – Avoids interference between analog/digital sections.

​​5. EMI/EMC Mitigation​​

• • ​​Ground Shielding​​ – Via stitching around high-speed traces.
  • ​​EMI Filters​​ – For RF-sensitive circuits

♦ Technical Parameters

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1. On-time Delivery:

• • Owned PCBA factories 15,000 ㎡
  • 13 fully automatic SMT lines
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• • IATF, ISO, IPC, UL standards
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  • The qualified rate of products reach 99.9%

3. Premium Service:

• • 24H reply your inquiry
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  • From prototype to mass production

Immersion Gold multilayer circuit board

sMD multilayer circuit board

12 Layer smd circuit board

Immersion Gold SMD Multilayer Circuit Board PCB 12 Layer For Communication Equipment Images